Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains

Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains

By modifying the accumulative roll-bonding (ARB) procedures, accumulative roll-bonding (ARB) processing up to 30 cycles (N) with a 50% thickness reduction per cycle (equivalent strain = 24) at room temperature was conducted on pure copper. The bonding condition, microhardness and electrical conducti...

Full description

Bibliographic Details
Main Authors: Gongcheng Yao, Qingsong Mei, Juying Li, Congling Li, Ye Ma, Feng Chen, Guodong Zhang, Bing Yang
Format: Article
Language:English
Published: MDPI AG 2016-05-01
Series:Metals
Subjects:
accumulative roll-bonding
pure copper
microhardness
electrical conductivity
Online Access:http://www.mdpi.com/2075-4701/6/5/115

Internet

http://www.mdpi.com/2075-4701/6/5/115

Similar Items