Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
Abstract With the ever-reducing sizes of electronic devices, the problem of electromigration (EM) has become relevant and requires attention. However, only the EM behavior of Sn–Ag solders within the solder joint structure has been focused on thus far. Therefore, in this study, a thin metallic film...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2021-04-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-021-88122-w |