Wafer Level Packaging Technology Applied to Pixel Detectors

Wafer Level Packaging Technology Applied to Pixel Detectors

Pixel technology is commonly used in the tracking systems of High Energy Physics detectors with physical areas that have largely increased in the last decades. To ease the production of several square meters of sensitive area, the possibility of using the industrial Wafer Level Packaging to reassemb...

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Bibliographic Details
Main Authors: Paolo Conci, Giovanni Darbo, Andrea Gaudiello, Claudia Gemme, Stefano Girardi, Alessandro Lapertosa, Francesca Mattedi, Alessio Volpe
Format: Article
Language:English
Published: Frontiers Media S.A. 2021-02-01
Series:Frontiers in Physics
Subjects:
wafer level packaging
pixel detector
flip-chip
CMOS active pixel sensors
3D pixel sensors
bump-bonding
Online Access:https://www.frontiersin.org/articles/10.3389/fphy.2021.625685/full

Internet

https://www.frontiersin.org/articles/10.3389/fphy.2021.625685/full

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