PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
Analysis of activation of solution and diffusion processes under the interaction between melt and solid is used. Dependence of the original material concentration on temperature, time, melt and solid area of contact, viscosity and melt volume is derived.
| Main Authors: | , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Don State Technical University
2018-07-01
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| Series: | Вестник Донского государственного технического университета |
| Subjects: | |
| Online Access: | https://vestnik.donstu.ru/jour/article/view/961 |