Interaction of silver nanopowder with copper substrate
Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studi...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
International Institute for the Science of Sintering, Beograd
2011-01-01
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| Series: | Science of Sintering |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/0350-820X/2011/0350-820X1101033S.pdf |