Interaction of silver nanopowder with copper substrate
Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studi...
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International Institute for the Science of Sintering, Beograd
2011-01-01
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doaj-f961de261f304a5a875a8ba501d9f5672020-11-24T21:00:17ZengInternational Institute for the Science of Sintering, BeogradScience of Sintering0350-820X2011-01-01431333810.2298/SOS1101033SInteraction of silver nanopowder with copper substrateSopoušek J.Buršík J.Zálešák J.Buršíková V.Brož P.Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.http://www.doiserbia.nb.rs/img/doi/0350-820X/2011/0350-820X1101033S.pdfsilvercoppersinteringDSCindentation |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Sopoušek J. Buršík J. Zálešák J. Buršíková V. Brož P. |
spellingShingle |
Sopoušek J. Buršík J. Zálešák J. Buršíková V. Brož P. Interaction of silver nanopowder with copper substrate Science of Sintering silver copper sintering DSC indentation |
author_facet |
Sopoušek J. Buršík J. Zálešák J. Buršíková V. Brož P. |
author_sort |
Sopoušek J. |
title |
Interaction of silver nanopowder with copper substrate |
title_short |
Interaction of silver nanopowder with copper substrate |
title_full |
Interaction of silver nanopowder with copper substrate |
title_fullStr |
Interaction of silver nanopowder with copper substrate |
title_full_unstemmed |
Interaction of silver nanopowder with copper substrate |
title_sort |
interaction of silver nanopowder with copper substrate |
publisher |
International Institute for the Science of Sintering, Beograd |
series |
Science of Sintering |
issn |
0350-820X |
publishDate |
2011-01-01 |
description |
Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. |
topic |
silver copper sintering DSC indentation |
url |
http://www.doiserbia.nb.rs/img/doi/0350-820X/2011/0350-820X1101033S.pdf |
work_keys_str_mv |
AT sopousekj interactionofsilvernanopowderwithcoppersubstrate AT bursikj interactionofsilvernanopowderwithcoppersubstrate AT zalesakj interactionofsilvernanopowderwithcoppersubstrate AT bursikovav interactionofsilvernanopowderwithcoppersubstrate AT brozp interactionofsilvernanopowderwithcoppersubstrate |
_version_ |
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