Thermal performance and reliability of procesor investigation using TiO2 and CuO/water nanofluids
Continuous miniaturization of feature size, faster operation and high-end performance of processor are facing serious problems to dissipate heat. In this numerical work, the surface temperature of the processor, heat transfer rate, power consumption and reliability of channel heat sink for processor...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
VINCA Institute of Nuclear Sciences
2020-01-01
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| Series: | Thermal Science |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/0354-9836/2020/0354-98361900433P.pdf |