Surface evolution and stability transition of silicon wafer subjected to nano-diamond grinding
In order to obtain excellent physical properties and ultrathin devices, thinning technique plays an important role in semiconductor industry with the rapid development of wearable electronic devices. This study presents a physical nano-diamond grinding technique without any chemistry to obtain ultra...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2017-03-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4979579 |