Buckle Driven Delamination in Thin Hard Film Compliant Substrate Systems
Deformation and fracture of thin films on compliant substrates are key factors constraining the performance of emerging flexible substrate devices. [1-3] These systems often contain layers of thin polymer, ceramic and metallic films and stretchable interconnects where differing properties induce...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2010-06-01
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| Series: | EPJ Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/epjconf/20100640006 |