Exploring the evolution of asymmetric pattern of mask hole during plasma etching process by particle simulation method
Damage on the mask surface caused by charging effect during plasma etching process continues to attract much attention currently. It has been observed that the round shape of holes in a mask can also be etched into the asymmetric shape due to factors, such as non-uniform plasma source and incline or...
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| Format: | Article |
| Language: | English |
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Elsevier
2019-03-01
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| Series: | Results in Physics |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379718334569 |