Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix
A series of thermoplastic polyimide (PI) films (PI-1~PI-5) with intrinsic heat sealability have been synthesized by the high-temperature polycondensation reaction of asymmetrical 2,3,3ꞌ,4ꞌ-oxydiphthalic anhydride (aODPA) and various aromatic diamines in order to meet the demands of advanced flexible...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Budapest University of Technology
2017-12-01
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| Series: | eXPRESS Polymer Letters |
| Subjects: | |
| Online Access: | http://www.expresspolymlett.com/letolt.php?file=EPL-0008452&mi=cd |