A Comparative Study of Thermal Aging Effect on the Properties of Silicone-Based and Silicone-Free Thermal Gap Filler Materials

A Comparative Study of Thermal Aging Effect on the Properties of Silicone-Based and Silicone-Free Thermal Gap Filler Materials

Thermal conductive gap filler materials are used as thermal interface materials (TIMs) in electronic devices due their numerous advantages, such as higher thermal conductivity, ease of use, and conformity. Silicone is a class of synthetic materials based on a polymeric siloxane backbone which is wid...

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Bibliographic Details
Main Authors: A S M Raufur Chowdhury, Monjur Morshed Rabby, Mehzabeen Kabir, Partha Pratim Das, Rabin Bhandari, Rassel Raihan, Dereje Agonafer
Format: Article
Language:English
Published: MDPI AG 2021-06-01
Series:Materials
Subjects:
thermal gap filler material
dynamic mechanical analysis
thermomechanical analysis
differential scanning calorimetry
Fourier transform infrared spectroscopy
broadband dielectric spectroscopy
Online Access:https://www.mdpi.com/1996-1944/14/13/3565

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https://www.mdpi.com/1996-1944/14/13/3565

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