Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics

Currently, low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs), which are characterized by high mobility of electrons, are fabricated by excimer laser annealing. High mobility in low-temperature polycrystalline silicon is achieved by controlling the grain size to approximatel...

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Main Authors: Akira Mizutani, Fuminobu Hamano, Daisuke Nakamura, Tetsuya Goto, Siti Rahmah Aid, Hiroshi Ikenoue
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9475478/
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spelling doaj-fe31ff5aaa3143fda23d7e5628fb23172021-07-26T23:00:14ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-01967968610.1109/JEDS.2021.30947959475478Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT CharacteristicsAkira Mizutani0https://orcid.org/0000-0002-9917-5526Fuminobu Hamano1Daisuke Nakamura2Tetsuya Goto3https://orcid.org/0000-0001-8384-0096Siti Rahmah Aid4https://orcid.org/0000-0003-4756-3743Hiroshi Ikenoue5Department of Gigaphoton Next GLP, Kyushu University, Fukuoka, JapanGraduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, JapanGraduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, JapanNew Industry Creation Hatchery Center, Tohoku University, Sendai, JapanMalaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, Kuala Lumpur, MalaysiaDepartment of Gigaphoton Next GLP, Kyushu University, Fukuoka, JapanCurrently, low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs), which are characterized by high mobility of electrons, are fabricated by excimer laser annealing. High mobility in low-temperature polycrystalline silicon is achieved by controlling the grain size to approximately 300 nm. However, with future potential growth of active-matrix organic light-emitting diodes in terms of their increasing use as backlight in active matrix micro-LEDs, even higher mobility is required. One of the methods to improve mobility is to produce grains of sizes above 300 nm. However, as far as we know, there are no reports of investigating the dependence between the device characteristics and the grain size of above 300 nm. In this study, we examine the possibility of controlling the grain size above approximately 350 nm by laser annealing with an intensity distribution and investigate the grain size dependence of the TFT characteristics. We show that the grain size can be controlled approximately in the range of 1&#x2013;2.5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula>, and mobility of 248&#x00B1;28 cm<sup>2</sup> V<sup>&#x2212;1</sup>s<sup>&#x2212;1</sup> is achieved at a grain size of 2.5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula>. Furthermore, we compare the device characteristics of the step-and-repeat and scan annealing and verify that the device characteristics do not deteriorate even during scan annealing. The study confirms that it is technically possible to produce LTPS with grain sizes controlled in the range of 1&#x2013;2.5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> for customizing device characteristics.https://ieeexplore.ieee.org/document/9475478/Low temperature polycrystalline Si (LTPS)thin-film-transistor (TFT)excimer laser annealing (ELA)
collection DOAJ
language English
format Article
sources DOAJ
author Akira Mizutani
Fuminobu Hamano
Daisuke Nakamura
Tetsuya Goto
Siti Rahmah Aid
Hiroshi Ikenoue
spellingShingle Akira Mizutani
Fuminobu Hamano
Daisuke Nakamura
Tetsuya Goto
Siti Rahmah Aid
Hiroshi Ikenoue
Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics
IEEE Journal of the Electron Devices Society
Low temperature polycrystalline Si (LTPS)
thin-film-transistor (TFT)
excimer laser annealing (ELA)
author_facet Akira Mizutani
Fuminobu Hamano
Daisuke Nakamura
Tetsuya Goto
Siti Rahmah Aid
Hiroshi Ikenoue
author_sort Akira Mizutani
title Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics
title_short Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics
title_full Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics
title_fullStr Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics
title_full_unstemmed Size Effects of Poly-Si Formed by Laser Annealing With Periodic Intensity Distribution on the TFT Characteristics
title_sort size effects of poly-si formed by laser annealing with periodic intensity distribution on the tft characteristics
publisher IEEE
series IEEE Journal of the Electron Devices Society
issn 2168-6734
publishDate 2021-01-01
description Currently, low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs), which are characterized by high mobility of electrons, are fabricated by excimer laser annealing. High mobility in low-temperature polycrystalline silicon is achieved by controlling the grain size to approximately 300 nm. However, with future potential growth of active-matrix organic light-emitting diodes in terms of their increasing use as backlight in active matrix micro-LEDs, even higher mobility is required. One of the methods to improve mobility is to produce grains of sizes above 300 nm. However, as far as we know, there are no reports of investigating the dependence between the device characteristics and the grain size of above 300 nm. In this study, we examine the possibility of controlling the grain size above approximately 350 nm by laser annealing with an intensity distribution and investigate the grain size dependence of the TFT characteristics. We show that the grain size can be controlled approximately in the range of 1&#x2013;2.5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula>, and mobility of 248&#x00B1;28 cm<sup>2</sup> V<sup>&#x2212;1</sup>s<sup>&#x2212;1</sup> is achieved at a grain size of 2.5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula>. Furthermore, we compare the device characteristics of the step-and-repeat and scan annealing and verify that the device characteristics do not deteriorate even during scan annealing. The study confirms that it is technically possible to produce LTPS with grain sizes controlled in the range of 1&#x2013;2.5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> for customizing device characteristics.
topic Low temperature polycrystalline Si (LTPS)
thin-film-transistor (TFT)
excimer laser annealing (ELA)
url https://ieeexplore.ieee.org/document/9475478/
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