Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex processes for the interconnection of metal wires...

Full description

Bibliographic Details
Main Authors: Dongling Li, Zhengguo Shang, Yin She, Zhiyu Wen
Format: Article
Language:English
Published: MDPI AG 2017-05-01
Series:Micromachines
Subjects:
heating/cooling rate
contact force
adhesion layer
bonding strength
bonding interface
wafer-level packaging
Online Access:http://www.mdpi.com/2072-666X/8/5/158

Internet

http://www.mdpi.com/2072-666X/8/5/158

Similar Items