Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers
Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex processes for the interconnection of metal wires...
Main Authors: | Dongling Li, Zhengguo Shang, Yin She, Zhiyu Wen |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2017-05-01
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Series: | Micromachines |
Subjects: | |
Online Access: | http://www.mdpi.com/2072-666X/8/5/158 |
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