Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage

Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage

Fracture and breakage of single crystals, particularly of silicon wafers, are multi-scale problems: the crack tip starts propagating on an atomic scale with the breaking of chemical bonds, forms crack fronts through the crystal on the micrometre scale and ends macroscopically in catastrophic wafer s...

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Bibliographic Details
Main Authors: Alexander Rack, Mario Scheel, Andreas N. Danilewsky
Format: Article
Language:English
Published: International Union of Crystallography 2016-03-01
Series:IUCrJ
Subjects:
materials science
X-ray diffraction imaging
phase-contrast X-ray imaging
time-resolved studies
Online Access:http://scripts.iucr.org/cgi-bin/paper?S205225251502271X

Internet

http://scripts.iucr.org/cgi-bin/paper?S205225251502271X

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