Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, coppe...

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Bibliographic Details
Main Authors: Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder
Format: Article
Language:English
Published: MDPI AG 2021-04-01
Series:Energies
Subjects:
power packaging
clip bonding
sinter paste
copper paste
planar interconnects
wire-bondless packaging
Online Access:https://www.mdpi.com/1996-1073/14/8/2176

Internet

https://www.mdpi.com/1996-1073/14/8/2176

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