Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, coppe...
Main Authors: | Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-04-01
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Series: | Energies |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1073/14/8/2176 |
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