Interface behavior and electrical properties of Zn–Sn–Cu (CTZ) stacking layer films with thermal diffusion and electrically induced crystallization
In this study, a Zn–Sn–Cu sandwich structure was heated and electrically crystallized. The morphology, phase structure, diffusion behavior, and interface electrical properties of the sandwich structure and the microstructure changes in Zn, Sn, and Cu driven by heat and electricity were investigated....
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785420319657 |