Curing Kinetics and TTT Diagram of High Temperature Resistance Bismaleimide Resin
The curing kinetics of high temperature resistance bismaleimide resin was studied by dynamic DSC analysis, and the parameters of the curing reaction were obtained to establish a phenomenological model based on Kissinger and Crane equations. The relationship between glass transition temperature and c...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Journal of Materials Engineering
2016-09-01
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| Series: | Journal of Materials Engineering |
| Subjects: | |
| Online Access: | http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2016.09.007 |