Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching

The fabrication of silicon nanohole (SiNH) using a combination of electron beam lithography (EBL) and reactive ion etching (RIE) processes is reported. The optimum exposure dose of EBL process was found to be in the range of 210-240 μC/cm2 due to small enlargement of hole diameter after pattern deve...

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Bibliographic Details
Main Authors: Lita Rahmasari (Author), Mohd Faizol Abdullah (Author), Ahmad Rifqi Md Zain (Author), Abdul Manaf Hashim (Author)
Format: Article
Language:English
Published: Penerbit Universiti Kebangsaan Malaysia, 2019-06.
Online Access:Get fulltext
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042 |a dc 
100 1 0 |a Lita Rahmasari,   |e author 
700 1 0 |a Mohd Faizol Abdullah,   |e author 
700 1 0 |a Ahmad Rifqi Md Zain,   |e author 
700 1 0 |a Abdul Manaf Hashim,   |e author 
245 0 0 |a Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching 
260 |b Penerbit Universiti Kebangsaan Malaysia,   |c 2019-06. 
856 |z Get fulltext  |u http://journalarticle.ukm.my/13706/1/01%20Lita%20Rahmasari.pdf 
520 |a The fabrication of silicon nanohole (SiNH) using a combination of electron beam lithography (EBL) and reactive ion etching (RIE) processes is reported. The optimum exposure dose of EBL process was found to be in the range of 210-240 μC/cm2 due to small enlargement of hole diameter after pattern development process. The anisotropic etching and isotropic etching was achieved at low and high reaction pressures, respectively. As expected, the etching rate increase with time and RF power. A relatively smooth and well-defined NH has been obtained at RF power of 100 W and reaction pressure of 0.08 Torr, which is suitable to be applied for optical waveguide. 
546 |a en