Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises s...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
Hindawi Publishing Corporation ,
2014.
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Subjects: | |
Online Access: | Get fulltext |