Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS
In the present study, three-dimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs subjected to thermo-cyclic loading. The commercial FEA...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor's University,
2014-02.
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| Subjects: | |
| Online Access: | Get fulltext |