Application of signal analysis techniques for condition monitoring of a wire bonding machine
This paper investigates the technique to monitor the condition of a wire bonding machine that used in the integrated manufacturing (IC) industry. The machine forms the connection between the bonding pad on the die to the contacts of the leadframe. To ensure consistency in the process, defects in the...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
ieee,
2000-09-24.
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| Subjects: | |
| Online Access: | Get fulltext |