Thermal performance analysis for optimal passive cooling heat sink design
Recent advances in semiconductor technology show the improvement of fabrication on electronics appliances in terms of performance, power density and even the size. This great achievement however led to some major problems on thermal and heat distribution of the electronic devices. This thermal probl...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universitas Ahmad Dahlan,
2017.
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| Subjects: | |
| Online Access: | Get fulltext |