Thermal and area optimization for component placement on PCB design using inverse genetic algorithm
Considering the current trend of compact designs which are mostly multiobjective in nature, proper arrangement of components has become a basic necessity so as to have optimal management of heat generation and dissipation. In this work, Inverse Genetic Algorithm (IGA) optimization has been adopted i...
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| Format: | Thesis |
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2015-12.
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| Online Access: | Get fulltext |