Thermomigration induced degradation in solder alloys
Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diff...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
State University of New York at Buffalo, USA,
2008-06-19.
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| Subjects: | |
| Online Access: | Get fulltext |