Study of interfacial reactions between lead-free solders and immersion silver finish
Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2008-11.
|
| Subjects: | |
| Online Access: | Get fulltext |