Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating

Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating

We devised a scalable, modular strategy for microfabricated 3-D neural probe synthesis. We constructed a 3-D probe out of individual 2-D components (arrays of shanks bearing close-packed electrodes) using mechanical self-locking and self-aligning techniques, followed by electroless nickel plating to...

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Bibliographic Details
Main Authors: Kopell, Nancy (Author), Scholvin, Jorg (Contributor), Zorzos, Anthony Nicholas (Contributor), Kinney, Justin (Contributor), Bernstein, Jacob G (Contributor), Moore-Kochlacs, Caroline (Contributor), Fonstad Jr, Clifton G (Contributor), Boyden, Edward (Contributor)
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Contributor), Massachusetts Institute of Technology. Media Laboratory (Contributor)
Format: Article
Language:English
Published: Multidisciplinary Digital Publishing Institute, 2018-09-28T14:58:04Z.
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