Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies

Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies

We report the extension of multi-strata subsurface infrared (1.342 μm) pulsed laser die singulation to the fabrication of defect-free ultra-thin stacked memory dies. We exploit the multi-strata interactions between generated thermal shockwaves and the preceding high dislocation density layers formed...

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Bibliographic Details
Main Authors: Teh, Weng Hong (Contributor), Boning, Duane S (Contributor), Welsch, Roy E (Contributor)
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Contributor), Massachusetts Institute of Technology. Department of Urban Studies and Planning (Contributor), Massachusetts Institute of Technology. Institute for Data, Systems, and Society (Contributor), Sloan School of Management (Contributor)
Format: Article
Language:English
Published: AIP Publishing, 2019-03-06T17:58:14Z.
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