The Transition From Rebound to Bonding in High-Velocity Metallic Microparticle Impacts: Jetting-Associated Power-Law Divergence

Abstract: A metallic microparticle impacting a metallic substrate with sufficiently high velocity will adhere, assisted by the emergence of jetting-the splash-like extrusion of solid matter at the periphery of the impact. In this work, we compare real-time observations of high-velocity single-microp...

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Bibliographic Details
Main Authors: Sun, Yuchen (Author), Veysset, David Georges (Author), Nelson, Keith Adam (Author), Schuh, Christopher A (Author)
Other Authors: Massachusetts Institute of Technology. Department of Chemistry (Contributor), Massachusetts Institute of Technology. Department of Materials Science and Engineering (Contributor), Massachusetts Institute of Technology. Institute for Soldier Nanotechnologies (Contributor)
Format: Article
Language:English
Published: ASME International, 2021-02-04T01:52:49Z.
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