Impact of Film Stress and Film Thickness Process Control on GaAs-TiAu Metal Adhesion
The fabrication of GaAs-based optoelectronic ridge-waveguide devices requires deposition of a topside-contact metallization for proper device operation. Fabrication delays occurring during the processing of TiAu-contact pads have been linked to poor adhesion and metal blister formation, factors that...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Springer Science and Business Media LLC,
2021-02-09T22:06:26Z.
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| Subjects: | |
| Online Access: | Get fulltext |