First Demonstration of a Self-Aligned GaN p-FET
In this work, we demonstrate a self-aligned p-FET with a GaN/Al0 2Ga0 8N (20 nm)/GaN heterostructure grown by metal-organic-chemical vapor deposition (MOCVD) on Si substrate. Our 100 nm channel length device with recess depth of 70 nm exhibits a record ON-resistance of 400 Ωmm and ON-current over 5...
| Main Authors: | , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE),
2021-12-10T21:52:10Z.
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| Subjects: | |
| Online Access: | Get fulltext |
| Summary: | In this work, we demonstrate a self-aligned p-FET with a GaN/Al0 2Ga0 8N (20 nm)/GaN heterostructure grown by metal-organic-chemical vapor deposition (MOCVD) on Si substrate. Our 100 nm channel length device with recess depth of 70 nm exhibits a record ON-resistance of 400 Ωmm and ON-current over 5 mA/mm with ON-OFF ratio of 6×105 when compared with other p-FET demonstrations based on GaN/AlGaN heterostructure. The device shows E-mode operation with a threshold voltage of -1 V, making it a promising candidate for GaN-based complementary circuit that can be integrated on a Silicon platform. A monolithically integrated n-channel transistor with p-GaN gate is also demonstrated. The potential of the reported p-FET for complementary logic application is evaluated through industry-standard compact modeling and inverter circuit simulation. |
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