Thermal Modeling and Device Noise Properties of Three-Dimensional-SOI Technology
Thermal test structures and ring oscillators (ROs) are fabricated in 0.18-mum three-dimensional (3-D)-SOI technology. Measurements and electrothermal simulations show that thermal and parasitic effects due to 3-D packaging have a significant impact on circuit performance. A physical thermal model is...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers,
2010-03-09T18:25:46Z.
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| Subjects: | |
| Online Access: | Get fulltext |