A 10Gb/s compact low-power serial I/O with DFE-IIR equalization in 65nm CMOS

The design of compact low-power I/O transceivers continues to be a challenge for both chip-to-chip and backplane applications. The introduction of dense fine-pitch silicon packaging technologies, that in principle are capable of supporting tens of thousands of high-data-rate I/O for local chip-to-ch...

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Bibliographic Details
Main Authors: Kim, Byungsub (Contributor), Dickson, Timothy O. (Author), Liu, Yong (Author), Bulzacchelli, John F. (Author), Friedman, Daniel J. (Author)
Other Authors: Massachusetts Institute of Technology. Research Laboratory of Electronics (Contributor)
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers, 2010-11-05T18:54:39Z.
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