Characterization of Three-Dimensional-Integrated Active Pixel Sensor for X-Ray Detection
We have developed a back-illuminated active pixel sensor (APS) which includes an SOI readout circuit and a silicon diode detector array implemented in a separate high-resistivity wafer. Both are connected together using a per-pixel 3-D integration technique developed at Lincoln Laboratory. The devic...
Main Authors: | , , , , , , , , |
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Other Authors: | , , |
Format: | Article |
Language: | English |
Published: |
IEEE transactions on electron devices,
2010-12-02T22:20:26Z.
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Subjects: | |
Online Access: | Get fulltext |