Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model
Chemical mechanical planarization (CMP) pad stiffness and conditioning effects were evaluated based on a physical die-level CMP model, with pad effective modulus and asperity height as parameters. In one study, patterned dielectric wafers were polished using polymeric pads of different stiffnesses....
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Electrochemical Society,
2012-06-18T13:24:38Z.
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| Subjects: | |
| Online Access: | Get fulltext |