Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration

Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration

Silicon-on-lattice engineered substrates (SOLES) are SOI substrates with embedded Ge layers that facilitate III-V compound integration for advanced integrated circuits. The new materials integration scheme in SOLES requires the analysis of its thermal stability and diffusion barrier properties. In t...

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Main Authors: Bulsara, Mayank (Contributor), Fitzgerald, Eugene A. (Contributor), Yang, N. (Contributor), Liu, W. K. (Author), Lubyshev, D. (Author), Fastenau, J. M. (Author), Wu, Y. (Author), Urteaga, M. (Author), Ha, W. (Author), Bergman, J. (Author), Brar, B. (Author), Drazek, C. (Author), Daval, N. (Author), Benaissa, L. (Author), Augendre, E. (Author), Hoke, William E. (Author), LaRoche, J. R. (Author), Herrick, K. J. (Author), Kazior, T. E. (Author)
Other Authors: Massachusetts Institute of Technology. Department of Materials Science and Engineering (Contributor)
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers (IEEE), 2012-10-01T16:34:32Z.
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