Defect reduction in Cu chemical-mechanical polishing
The chemical-mechanical polishing (CMP) of Cu is a critical step in the manufacture of ultra-large-scale integrated (ULSl) semiconductor devices. During this process, undesirable scratches are formed on the surface being polished [I -3]. Recent research suggests that the "killer" scratches...
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| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers,
2013-04-10T19:52:25Z.
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| Subjects: | |
| Online Access: | Get fulltext |