ADVANCED THERMOSONIC WIRE BONDING USING HIGH FREQUENCY ULTRASONIC POWER: OPTIMIZATION, BONDABILITY, AND RELIABILITY
Gold wire bonding typically uses 60 KHz ultrasonic frequency. Studies have been reported that increasing ultrasonic frequency from 60KHz to 120KHz can decrease bonding time, lower bonding temperature, and/or improve the bondability of Au metalized organic substrates. This thesis presents a systemati...
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DigitalCommons@CalPoly
2009
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| Online Access: | https://digitalcommons.calpoly.edu/theses/177 https://digitalcommons.calpoly.edu/cgi/viewcontent.cgi?article=1181&context=theses |