Electronic Transport in Metallic Carbon Nanotubes with Metal Contacts

The continuous migration to smaller feature sizes puts high demands on materials and technologies for future ultra-large-scale integrated circuits. Particularly, the copper-based interconnect system will reach fundamental limits soon. Their outstanding properties make metallic carbon nanotubes (CNTs...

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Bibliographic Details
Main Author: Zienert, Andreas
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Doctoral Thesis
Language:English
Published: Universitätsbibliothek Chemnitz 2013
Subjects:
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-108205
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-108205
http://www.qucosa.de/fileadmin/data/qucosa/documents/10820/Dissertation_Andreas_Zienert.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/10820/signatur.txt.asc