A Study of Tungsten Metallization for the Advanced BEOL Interconnections

A Study of Tungsten Metallization for the Advanced BEOL Interconnections

In this paper, a study of tungsten metallization in advanced BEOL interconnects is presented. A mature 10 nm process is used for comparison between the tungsten and conventional copper metallization. Wafers were processed together till M1 dual-damascene etch then separated for different metallizatio...

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Bibliographic Details
Main Authors: Chen, James Hsueh-Chung, Fan, Susan Su-Chen, Standaert, Theodorus E., Spooner, Terry A., Paruchuri, Vamsi
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Others
Language:English
Published: Universitätsbibliothek Chemnitz 2016
Subjects:
copper
interconnect
tungsten
10 nm
ddc:620
Kupfer
Wolfram
Metallisieren
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207035
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207035
http://www.qucosa.de/fileadmin/data/qucosa/documents/20703/Chen_%20A_Study_of_Tungsten_Metallization_for_the_%20Advanced_BEOL_Interconnections.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20703/signatur.txt.asc

Internet

http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207035
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207035
http://www.qucosa.de/fileadmin/data/qucosa/documents/20703/Chen_%20A_Study_of_Tungsten_Metallization_for_the_%20Advanced_BEOL_Interconnections.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20703/signatur.txt.asc

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