Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment

Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment

Plasma induced damage of ultra low-k (ULK) dielectrics is a common phenomenon in BEOL interconnects. The damage leads to an increase in k-value, which raises the RC delay, leading to increased power consumption and cross talk noise. Therefore, diverse repair and post etch treatments (PET) have been...

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Bibliographic Details
Main Authors: Calvo, Jesús, Steinke, Philipp, Wislicenus, Marcus, Gerlich, Lukas, Seidel, Robert, Clauss, Ellen, Uhlig, Benjamin
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Others
Language:English
Published: Universitätsbibliothek Chemnitz 2016
Subjects:
plasma
low-k
dielectrics
repair
etch
ddc:620
Plasma
Low-k-Dielektrikum
Dielektrikum
Ätzen
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207098
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207098
http://www.qucosa.de/fileadmin/data/qucosa/documents/20709/Calvo_Organosilane_Downstream_Plasma_On_Ultra_Low-k_Dielectrics.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20709/signatur.txt.asc

Internet

http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207098
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207098
http://www.qucosa.de/fileadmin/data/qucosa/documents/20709/Calvo_Organosilane_Downstream_Plasma_On_Ultra_Low-k_Dielectrics.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20709/signatur.txt.asc

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