Surface planarization of Cu and CuNiSn Micro-bumps embedded in polymer for below 20μm pitch 3DIC applications
Planarization techniques such as Surface planer (better known as Fly-cut) and chemical-mechanical polishing (CMP) can be used to improve the bump roughness and bump height uniformity within the die and wafer which can be beneficial for solder based bump stacking and Cu-Cu direct bonding [1]. In this...
| Main Authors: | , , , , , , , |
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| Other Authors: | |
| Format: | Others |
| Language: | English |
| Published: |
Universitätsbibliothek Chemnitz
2016
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| Subjects: | |
| Online Access: | http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207164 http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207164 http://www.qucosa.de/fileadmin/data/qucosa/documents/20716/De_Preter_Surface_planarization_of_Cu_and_CuNiSn_Micro-bumps_embedded_in_polymer_for_below_20%C2%B5m_pitch_3DIC_applications.pdf http://www.qucosa.de/fileadmin/data/qucosa/documents/20716/signatur.txt.asc |
Internet
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207164http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207164
http://www.qucosa.de/fileadmin/data/qucosa/documents/20716/De_Preter_Surface_planarization_of_Cu_and_CuNiSn_Micro-bumps_embedded_in_polymer_for_below_20%C2%B5m_pitch_3DIC_applications.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20716/signatur.txt.asc