SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chips

SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chips

In this paper SAM (self-assembled monolayers) is used to passivate cobalt microbumps for 3D-stacking of Si chips. The SAM deposition process is optimized, using input from characterization techniques such as water contact angle measurement, ATR, AFM and XPS analysis in order to form a monolayer of T...

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Bibliographic Details
Main Authors: Hou, Lin, Derakhshandeh, Jaber, Armini, Silvia, Gerets, Carine, De Preter, Inge, June Rebibis, Kenneth, Miller, Andy, De wolf, Ingrid, Beyne, Eric
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Others
Language:English
Published: Universitätsbibliothek Chemnitz 2016
Subjects:
microbumps
Co UBM
3D stacking
self-assembled monolayer
TCB
ddc:620
Monoschicht
Cobalt
Selbstorganisation
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207172
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207172
http://www.qucosa.de/fileadmin/data/qucosa/documents/20717/Hou_SAMs_%28self-assembled%20monolayers%29_passivation_of_cobalt_microbumps_for_3D_stacking_of_Si_chips.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20717/signatur.txt.asc

Internet

http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207172
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207172
http://www.qucosa.de/fileadmin/data/qucosa/documents/20717/Hou_SAMs_%28self-assembled%20monolayers%29_passivation_of_cobalt_microbumps_for_3D_stacking_of_Si_chips.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20717/signatur.txt.asc

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