Gefügeeinfluß auf das Elektromigrationsverhalten von Kupferleitbahnen für höchstintegrierte Schaltungen
The increasing clock speed and the further reduction of the feature size in integrated circuits lead to increasing demands on the interconnecting material. Thus an increasing need for a metallization with low electrical resistance and high electromigration endurance exist. Copper can be count as a m...
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| Format: | Doctoral Thesis |
| Language: | deu |
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Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden
2002
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| Online Access: | http://nbn-resolving.de/urn:nbn:de:swb:14-1033475450500-73035 http://nbn-resolving.de/urn:nbn:de:swb:14-1033475450500-73035 http://www.qucosa.de/fileadmin/data/qucosa/documents/984/1033475450500-7303.pdf |