Polymer-Based Wafer-Level Packaging of Micromachined HARPSS Devices

Polymer-Based Wafer-Level Packaging of Micromachined HARPSS Devices

This thesis reports on a new low-cost wafer-level packaging technology for microelectromechanical systems (MEMS). The MEMS process is based on a revised version of High Aspect Ratio Polysilicon and Single Crystal Silicon (HARPSS) technology. The packaging technique is based on thermal decomposition...

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Bibliographic Details
Main Author: Monadgemi, Pezhman
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2006
Subjects:
Wafer-level metal-organic packaging
Sacrificial polymer
Polymer overcoat
HARPSS
Microelectronic packaging Materials
Microelectronic packaging Design
Online Access:http://hdl.handle.net/1853/11473

Internet

http://hdl.handle.net/1853/11473

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