Physical Design Automation for System-on-Packages and 3D-Integrated Circuits
The focus of this research was to develop interconnect-centric physical design tools for 3D technologies. A new routing model for the SOP structure was developed which incorporated the 3D structure and formalized the resource structure that facilitated the development of the global routing tool. Th...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2007
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| Online Access: | http://hdl.handle.net/1853/14012 |