| Summary: | The focus of this research was to develop interconnect-centric
physical design tools for 3D technologies.
A new routing model for the SOP structure was developed which
incorporated the 3D structure and formalized the resource structure
that facilitated the development of the global routing tool.
The challenge of this
work was to intelligently convert the 3D SOP routing problem into a set
of 2D problems which could be solved efficiently.
On the lines of MCM, the global routing problem
was divided into a number of phases namely, coarse pin distribution,
net distribution, detailed pin distribution, topology generation, layer
assignment, channel assignment and local routing. The novelty in this
paradigm is due to the feed-through vias needed by the nets which traverse
through multiple placement layers. To gain further improvements in
performance, optical
routing was proposed and a cost analysis study was done. The areas for
the placement of waveguides were efficiently determined, which reduced
delays and maximized utilization.
The global router developed was integrated into a simulated-annealing based
floorplanner to investigate trade-offs of various objectives. Since power-supply
noise suppression is of paramount importance in SOP, a model was developed
for the SOP power-supply network. Decap allocation, and
insertion were also integrated into the framework. The challenges
in this work were to integrate computationally intensive analysis tools with
a floorplanning that works to its best efficency provided the evaluation of
the cost functions are rapid. Trajectory-based approaches were used to sample
representative data points for congestion analysis and interpolate the
the congestion metric during the optimization schedule. Efficient
algorithms were also proposed for 3D clock routing, which acheived
equal skews under uniform and worst thermal profiles. Other
objectives such as wirelength, through-vias, and
power were also handled.
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