Chip-Package Nano-Structured Copper and Nickel Interconnections with Metallic and Polymeric Bonding Interfaces
With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2007
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| Online Access: | http://hdl.handle.net/1853/14096 |